CRAIC Technologies has introduced FilmPro film thickness measurement software to plug into its microspectrophotometers and Lambdafire software.
CRAIC FilmPro allows users to measure the thickness of thin films rapidly and non-destructively.
Able to analyse films of many materials on both transparent and opaque substrates, the software enables users to determine thin film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. It can be used in many different fields and in everything from research to industrial settings.
“Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products,” said Paul Martin, president of CRAIC Technologies.
“CRAIC FilmPro is a plug-in module that can be added to a CRAIC Technologies microspectrophotometer to enable this capability. The software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates.”
The complete CRAIC Technologies microspot film thickness solution combines an advanced microspectrophotometer with the new software.
It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates. Sampling areas can range from more than 100 microns across to less than a micron.
Suitable for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes and tools for analysing data.
With the addition of spectral mapping from CRAIC Technologies, film thickness maps of entire devices can be created.