Technical paper describes recent advances in IR camera technology, which are enabling the electronics industry to develop new generations of improved products
The electronics industry is rich in applications for IR cameras, from the simple inspection of PCBs during go/no-go testing to the microscopic examination of wafers.
All these applications share in common the need for accurate measurement of IR radiation through carefully designed infrared imaging instruments.
Offering what is said to be leading-edge optical performance, high sensitivity, and fast frame rate, the Cedip Jade IR camera range delivers many advantages for use in electronics applications. With current and future generation of microprocessors demanding ever increasing clock frequencies, the need to implement effective heat sink mechanisms at the board and chip levels is dictating a high level of research into new heat dissipative materials and technological solutions.
To offer a practical solution to these demands, Cedip has developed a set of microscopic lenses for its Jade camera range specifically designed for the electronic microscopy applications that offer spatial resolution of 20um and 10um respectively.
Gaining improvement in the heat dissipation of electronic packages is another area of great interest to the electronics industry, since greater and greater performance is required from these components.
The new article describes and illustrates how Jade IR cameras may be used in these applications to study how the heat dissipates in the package and within the PCB around the package. Further examples shown include the use of Jade IR cameras to inspect printed circuit board (PCB) which is gaining popularity with electronics manufacturers for troubleshooting new circuit developments and for maintenance applications.
