New equipment allows for more detailed materials characterisation, non-destructive evaluation and test, and surface analysis of electronic parts
Reliability Analysis Laboratory has expanded its electronic
component analysis services to include more detailed
investigations in the areas of materials characterisation,
non-destructive evaluation and test (NDE/NDT), and surface
analysis of microprocessors, discrete components, and printed
circuit boards and assemblies.
The addition of a new real-time
x-ray system allows the RAL to non-destructively test a wider
variety of miniature parts.
Using the system, microelectronic
components can be magnified to 200X, allowing for more detailed
detection of faults in soldered leads, voids in substrates and
die attaches, cracks in ceramics, and placement of internal
In addition, a new x-ray fluorescence system quickly
and accurately measures the coating thickness and alloy
composition of virtually any metal on printed circuit boards,
connector contacts, and screws, including single, binary, and
ternary alloy coatings, double coatings with one alloy layer, and
RAL's materials characterisation
capabilities have been strengthened by the acquisition of a new
PC-based, energy dispersive x-ray spectroscopy (EDS) system.
to detect low atomic number elements with high energy resolution,
the system provides improved peak overlap identification allowing
faster and more accurate analysis of materials used during the
component manufacturing process, including silver, tin, and lead.
A new, advanced backscatter detector has been added to the
RAL's field emission scanning electron microscope (SEM),
allowing for more rapid identification of part problems.
number contrast is observable at easy-to-see TV rates and at SEM
accelerating voltages as low as 1KeV.
This allows for easier
detection of product failure areas in uncoated microelectronic
devices, such as gallium arsenide ICs.