Ultrasound excited thermography provides a unique method of detection of mechanical hysterisis in materials caused by cracks, delaminations, poor bonding or other material weaknesses
Cedip Infrared Systems has released a new technical paper that describes a technique providing defect selective recognition of material failure.
Ultrasound excited thermography is a new non-destructive testing/non-destructive examination technology developed and patented in a cooperative venture with IKP (University of Stuttgart) and Enhanced Defect Visualisation.
Based upon the interaction of elastic and thermal waves, the paper describes how ultrasound excited thermography provides a unique method of detection of mechanical hysterisis in materials caused by cracks, delaminations, poor bonding or other material weaknesses.
Technical background to the technique is discussed and several applications of the technology as applied in the automotive industry illustrated.
The paper shows how the new technique can be used to rapidly and efficiently inspect areas as large as 0.5x0.5 metres.
Beneficially, ultrasound excited thermography can detect cracks independent of their orientation.
Consequently even sub-surface cracks can be found, which provides a considerable advantage over traditional and time consuming colour penetration tests.
