A research programme examining X-ray diffraction (XRD) thin film stress analysis techniques has been conducted by Panalytical in cooperation with the Max Planck Institute for Metals Research
The partnership has yielded information that will lead to new commercial developments.
A scientific review article has been published, and the acquired in-house knowledge is providing Panalytical with the scientific and practical basis to develop new commercial applications of residual stress analysis on polycrystalline thin films, coatings and surfaces.
A report on the collaboration, together with options to download the review article published in the Journal of Applied Crystallography, can be found on Panalytical's website.
The analysis of residual stress in thin films, coatings and surface layers is of great technological importance and demand is growing for a commercial way to determine residual stresses in polycrystalline thin films.
Stresses can have both beneficial and detrimental effects on the mechanical properties of these materials.
For example, tensile stress can cause cracking of a film and compressive stress can lead to buckling.
However, applying a compressive pre-stress to a film or surface layer during production may prevent it cracking in later use.
Panalytical's XRD systems are used for polycrystalline thin film research in a variety of industries.
While a number of methods are available for stress analysis, XRD is the most suitable for films, coatings and surface layers.
Furthermore it is applicable to an extensive range of materials.
These include measuring titanium carbide on steel and TiAlN coatings on tool inserts, determining surface stresses in ceramics and oxide coatings on glass, and analysing Cu damascene interconnects used in the semiconductor industry.
