Uniscan has published the 'OSP-SECM Height Relief. Application: Corrosion' technical sales-supplement.
The supplement demonstrates the use of topographic measurements in conjunction with scanning electrochemical microscopy for corrosion applications.
The importance of scanning electrochemical microscopy (SECM) to corrosion applications is of growing interest to scientific and commercial sectors.
SECM's high-resolution capabilities, coupled with its quantitative analytical capabilities, provide a novel method to interrogate and image a surface's corrosion resistance.
The combination of the Optical-Surface Profiling (OSP) technique with the SECM allows a user to take a measure of the surface features and relieve the SECM probe's position during the scan.
With the addition of height-tracking, it is possible to effectively remove the effects of topology, resulting in an unbiased measure of the electrochemical activity.
