Torrey Pines Scientific has introduced the WaferPlate HP90, a programmable laboratory heating system offering high temperature uniformity and precise control for silicon wafers and other demanding electronics applications.
Torrey Pines Scientific has launched its new WaferPlate™ Model HP90 Programmable Bake Plate, designed specifically for the precise heating of 12-inch silicon wafers and other temperature-sensitive components.
The HP90 features a large 13.875-inch (352.4 mm) circular, milled-flat aluminium heating surface, providing temperature uniformity of better than 1% across the central 12-inch area. This makes the system suitable for processing silicon wafers up to 304.8 mm in diameter, as well as electronic chips, displays, adhesives and photoresists.
Operating from room temperature up to 350°C, the plate can be set and controlled in 1°C increments. Temperature is monitored using a platinum RTD integrated into the heater plate, while temperature ramping can be programmed from 1°C/hour up to 450°C/hour.
For automated and repeatable laboratory processes, the HP90 includes a benchtop controller capable of storing five routines with up to 10 steps each. Individual programs can be configured to repeat between one and 98 times or operate continuously.
Users can also remotely control the bake plate from a PC or industrial controller through an RS232 I/O connection, providing additional flexibility when integrating the unit into automated processes.
Additional features include a countdown timer with alarm and a user-adjustable automatic shut-off function. Units are supplied with temperature calibration certificates traceable to NIST.
The WaferPlate HP90 is available in 100, 115 and 230 VAC versions, with a power rating of 1,500 watts and 50/60 Hz operation. ETL, CSA and CE certification is currently pending.
