MRA products combine extremely low thermal resistance packaging with high optical efficiency beam-shaping reflector cavities, gold-plated for near-infrared and silver-plated for the UV and visible
This combination means that the LED die operate at far higher outputs than in conventional moulded packages while the optical efficiency is several times that of simple chip-on-board solutions.
As a result a single compact two-leaded MRA can replace several hundred moulded devices with the further benefit of excellent beam quality with no halo effect.
These latest products offer system designers the familiar compact footprint and extremely low profile package but with a FWHM beam angle of 70deg, resulting in a 2.5 times increase in the radiant intensity of the 110deg design.
The new 070 series are available in the same range of wavelengths as the original products, 405nm, 470nm, 525nm, 615nm, 830nm and 870nm while the use of standard LED chip technology means that there is plenty of scope for application specific solutions requiring different wavelengths.
