FEI Company has introduced a range of dual-beam instruments that delivers an imaging and milling capability for applications in semiconductor and materials science research and development.
The Helios Nanolab x50 Dualbeam Series integrates the company's extreme high-resolution scanning electron microscope (XHR SEM) with a focused ion beam (FIB).
According to John Williams, FEI's director of corporate and strategic marketing, the Helios Nanolab x50 Dualbeam Series combines SEM imaging and FIB milling performance with improved resolution and stability for advanced applications in failure analysis, nanoscale characterisation, nanoprototyping and sample preparation.
The Tomahawk FIB, originally introduced in the V400Ace and now empowered with FEI's latest fast switching technology, provides the SEM and FIB live monitoring of milling operations, a smaller FIB spot for more precise milling control and higher beam currents for faster material removal on large structures, such as through silicon vias (TSVs).
The company claims that the overall throughput of advanced TEM lamella preparation has been improved by 40 per cent.
'The Helios 450(S) series is designed primarily for today's advanced semiconductor labs that are dealing with numerous challenges, including shrinking dimensions at sub-32nm nodes; advanced packaging techniques, such as TSVs and multi-die stacks; as well as a higher volume of samples requiring TEM imaging,' said Williams.
The Helios 650 is designed for academic and industrial research centres that need to conduct advanced material characterisation and modification down to the single nanometre scale.
It delivers a wide range of information and high-quality 3D data in order to better understand material characteristics, such as particle/porosity distribution, crack propagation and other behaviours.
The sub-nanometre resolution of the Helios 650 at extremely low beam energies provides surface-specific imaging.
For nanoprototyping, the Helios 650 offers users the ability to create fine, complex structures over large areas (millimetres in size) with better control over dimensions, fewer artefacts and faster material removal rates.
The Helios 450(S) and 650 Series Dualbeam systems are available for ordering immediately.
