System does not require etch/deposition synchronisation signals from the etcher, and measures the etch depth directly rather than inferring it from the etch rate
Jobin Yvon introduces the TDM-200, a new unique sensor capable of measuring absolute trench depth in real time for Mems dry etching applications.
The result is an on-line tool that can be used to depth target deep trench etches produced by the Bosch Process. Based on Jobin Yvon's patented twin-spot interferometric camera and expertise in ellipsometry, the TDM200 measures the trench depth from the phase shift generated between two laser spots.
One laser spot is positioned on the mask and the other on the trench.
The system does not require etch/deposition synchronisation signals from the etcher, and measures the etch depth directly, rather than inferring it from the etch rate, as is required for traditional interferometry based tools.
This allows processes using the shortest etch cycles to be controlled. An integrated imaging CCD camera allows easy positioning of the two laser spots on the substrate.
A simple software interface provides an immediate reading of process etch depth and rate.
