Panalytical has announced that it will launch its 2830 ZT wafer analyser at Semicon in Japan, on 3-5 December 2008.
The 2830 ZT offers the capability for simultaneous non-contact determination of layer thickness and composition.
Designed specifically for the industry, it provides manufacturers with a tool for achieving the tightest process monitoring throughout the entire production chain.
With the 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) instrument, users benefit from accurate and precise determination of layer composition, thickness, contamination, dopant levels and surface uniformity on wafers up to 300mm.
It offers simultaneous measurement of up to 24 elements on stacks of up to 16 layers.
A host of features, including the 4kW SST-Max tube with Zeta technology, ensures that the system delivers and maintains fast and cost-effective multi-layer analysis with precision and maximum uptime.
Zeta technology eliminates X-ray tube aging, which enhances operational efficiency and reduces the need for drift correction and recalibration.
Productivity and instrument uptime are improved as a result.
Furthermore, SST-Max allows operation at a high constant current of 160 mA, delivering the high sensitivity for good light element performance.
The 2830 ZT is supplied with Panalytical's Superq software, which includes the FP Multi.
The intuitive user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.
The 2830 ZT meets all current industry norms and standards to provide fully automated, contamination-free wafer handling.
With a small footprint, good tool matching capabilities and various wafer loading options, ranging from manual to automatic, the 2830 ZT integrates into any fabrication environment.
