The 20/20 XL film-thickness measurement tool from Craic Technologies has been designed to non-destructively analyse microscopic areas of very large samples.
Developed for the semiconductor industry, this microspectrophotometer offers the ability to measure the thickness of thin films in both transmission and reflectance.
It also offers the ability to measure the Raman spectra of microscopic samples, along with ultraviolet and near-infrared microscopy of semiconductor and other types of samples.
Its flexible design gives the 20/20 XL the ability to analyse the largest samples, with applications including mapping the thin-film thickness of large devices, locating and identifying contaminants, and measuring strain in silicon.
The 20/20 XL offers an advanced film-thickness measurement unit, a Raman spectrometer, a UV-visible-NIR range microscope, high-resolution digital imaging and software.
It is designed to attach to large frames that can accommodate large-scale samples and is able to acquire data from microscopic features of very large samples by absorbance, reflectance or luminescence spectroscopy.
It can be used as an ultraviolet or infrared microscope, and Craic Apollo Raman spectroscopy modules may be added so that the user may also acquire small spot Raman spectra.
Additional features include: touch-screen controls; calibrated variable apertures; high sensitivity; durable design; and multiple imaging and spectroscopic techniques.
