Only six months after launch, these macro inspection systems already rank among the worldwide preferred systems for automated defect-detection and classification in the chip industry
Leica Microsystems says that various leading semiconductor manufacturers in Europe, USA, and Asia have ordered a series of automated defect-detection and classification systems for 200mm and 300mm production, totalling ?12million.
Only a half year after market launch, the LDS3000 and LDS3300 macro inspection systems already rank among the worldwide preferred systems for automated defect-detection and classification in the chip industry, says Leica.
As a result, 17 systems have been successfully installed in chip factories.
Together with the orders on hand and the expected follow-up orders, this should amount to about 40 systems by the end of 2005.
The application field is mainly defect monitoring in photolithography directly after coating, exposing or processing.
Product manager Thomas Groos attributes the increasing use of these systems in chip manufacturing to the "excellent detection performance and unprecedented service and support".
Another argument lies in the compact, modular design of this process control system, which enables easy integration into automated 200mm and 300mm wafer fabrication.
In the spring of 2005, the LDS series will be complemented by a new system, combining micro and macro defect detection for simultaneous use.
With that, Leica Microsystems is consequently following semiconductor manufacturers demands for higher productivity and optimised cost-of-ownership.
