At Pittcon 2006, FEI is featuring its EBS3 DualBeam system for rapid serial sectioning and 3D crystallographic reconstruction of materials.
At Pittcon 2006, FEI is featuring its EBS3 DualBeam system for rapid serial sectioning and 3D crystallographic reconstruction of materials.
It uses an FEI DualBeam (FIB/SEM) system with an EBSD detector and automation software.
EBS3 is an optimised extension to 'slice and view' technology pioneered by FEI.
While 'slice and view' generates serial images for 3D image reconstruction, EBS3 also provides crystallographic information, including serial EBSD orientation maps for quantitative 3D grain reconstruction, using the crystal orientation of each individual voxel within the volume of interest.
The automated data collection procedure includes accurate (re)positioning between the milling location and the EBSD location to accommodate the geometry requirements for both operations.
EBS3 was developed in collaboration with Prof Dr Hamish Fraser at Ohio State University and with HKL Technology (Oxford Instruments) as a strategic partner.
The basic concept of EBS3 was first introduced by FEI in April 2004.
Product development focused on a depth resolution similar to the lateral resolution (hundreds of slices) and on automated, unattended use for 60 hours or more.
The first beta customers included Ohio State University, Gent University (Belgium) and, recently, University of Manchester (UK).
"EBS3 users are now able to obtain a wealth of crystallographic information from a sample, including the orientation, position, size and shape of grains and phases within internal interfaces as well as grain boundary related data".
"A 3D view of these characteristics was previously an extremely difficult and time consuming endeavor," said Hamish Fraser of OSU.
"This will enhance research for 3D FE (finite element) modeling, alloy development, grain boundary engineering, and validation of stereological corrections".
"It will also result in faster development cycles for new nano-enabled materials".
Pittcon attendees can learn more about EBS3 and FEI's entire range of systems for nano-research and industry, nano-electronics and nano-biology by visiting the FEI booth (2045) at the Orange Country Convention Center in Orlando.
