FEI, a provider of atomic-scale imaging and analysis systems, has introduced the Helios 1200 full-wafer Dualbeam system - the latest member of the Helios Nanolab family.
The ability of the Helios 1200 to analyse full wafers up to 300mm improves the efficiency of semiconductor and data storage failure analysis and the manufacturing support that laboratories that need to deliver accurate data quickly to the production floor.
Larry Dworkin, product marketing manager for FEI's full wafer systems, said: 'We've designed the new Helios 1200 Dualbeam to provide the maximum productivity for failure analysis, process development and process-control requirements.
'The ability to introduce full wafers directly into the system allows users to navigate directly to multiple features of interest based on design data or information from other inspection and defect detection tools.
'Fast switching between imaging and milling permits precise, efficient control of the cross-sectioning process.
'And imaging resolution significantly better than any other instrument in its class ensures superior analytical results,' he added.
The Helios 1200 combines good scanning electron microscope (SEM) image resolution and fast switching between imaging and ion beam milling to deliver the rapid, reliable and efficient cross-sectional analysis of structures and defects.
Its ability to accommodate full wafers up to 300mm eliminates the time required to re-establish the navigational coordinate system when working with wafer pieces.
When the analysis demands the higher resolution capability of a dedicated scanning transmission electron microscope (S/TEM), FEI's Multiloader technology enables fast and secure sample transfer.
FEI's new automation software product, Ifast, improves the quality and consistency of multiple, site-specific samples in a single session at a cost per sample that is competitive with conventional SEM bulk sample preparations.
Optional energy-dispersive X-ray spectrometry (EDS) on thin samples offers compositional analysis with good spatial resolution.
The optional Omniprobe micromanipulator allows in-situ extraction of prepared TEM lamella.
The Omniprobe 300's new in-chamber needle exchange process eliminates the need to break chamber vacuum to obtain a new probe.
The Helios Nanolab 1200 Dualbeam system is available now.
