Drop shape analysis system checks the quality of 12" wafers for the semiconductor industry to identify any undesirable residues from rinsing or earlier processes
Large samples - no problem.
With the new DSA10L2E drop shape analysis system you can measure the surface properties of disks with a diameter of up to 300mm fully automatically.
This instrument has been specially developed for checking the quality of 12" wafers in the semiconductor industry, where the cleanness of the surface is of overriding importance.
Contact angle measurements with a test liquid are, for example, a very sensitive indication of whether any undesirable residues from rinsing liquids or previous processes are still to be found on the silicon wafer.
The system can move to any point on the sample to carry out the measurement and save the coordinates of the position for subsequent measurements.
12" wafers and rectangular plates with sides up to 400mm can be measured with the GH100R universal surface tester in combination with the fully automatic PA3570 y-q positioning system.
Apart from the features mentioned above for the DSA10L2E, the video system of the GH100R has both motor-controlled focus and motor-controlled zoom functions.
The wetting properties of plastic surfaces, LC panels or glass surfaces can be tested quickly and accurately with the GH100R.
