Flexible modular architecture, low power consumption, and wide range of accessories enable this module to be easily optimised for sensor integration and OEM applications
By integrating the latest 160x120 pixel uncooled microbolometer array with state-of-the-art digital signal processing electronics, Armstrong Optical says it is able to offer the IR106 infrared sensor module at a price that will make it the sensor of choice for third-party thermal imaging system builders.
The flexible modular architecture, low power consumption, and wide range of accessories enable it to be easily optimised for sensor integration and OEM applications.
Like its higher resolution older brothers, the IR108 and IR109, the IR106 offers a true power-in/video-out capability coupled with full system control via a built-in RS232 interface, says Armstrong.
Gain, offset, zoom, brightness, contrast and image display are all available through the interface, and the standard Pal/NTSC/composite video outputs can be augmented by an optional FireWire 1394 output, thereby increasing the versatility of this thermal sensor module.
The IR106 represents the latest of the new thermal imaging products available from Armstrong Optical - including a fully radiometric system the size of a mobile phone (the MobIR and 61650; M4) and a new top-of-the-range hand-held system for predictive/preventive maintenance applications (the IR928+).
