Material stress testing tool incorporates a flexure-based piezoelectric positioner, a capacitive probe displacement sensor, and a high-resolution load cell for testing of thin films under stress
Dynamic Structures and Materials has developed the Nanopress material stress testing tool to create a three- and four-point bend test system intended for nanopositioning motion control in mechanical break junction circuit development and in thin film stress testing.
The Nanopress incorporates a flexure-based piezoelectric positioner, a capacitive probe displacement sensor, and a high-resolution load cell for testing of thin films under stressed conditions.
The system's design includes a coarse 1.5mm adjustment capability for specimen load/unload and a piezo-driven flexure stage for 40 microns of nanopositioning motion control.
An open aperture allows for instrumentation or observation of the sample during testing.
A brochure is available.
Dynamic Structures and Materials (DSM) specialises in the design, development, integration, and support of micropositioning, nanopositioning, and robotic positioning devices and systems for precision motion control applications in the semiconductor, aerospace, medical, and research industries.
The company says its core competencies in the design and integration of specialty piezoelectric actuators and stages, piezo amplifiers and drivers, and robotic platforms enable innovative positioning solutions for unique applications.
