This latest version enhances ePhysics's 3D steady-state thermal, transient thermal and linear stress analyses coupling to HFSS and Maxwell 3D with dynamic-link co-simulation
The new capability allows engineers to simulate heating, stress and deformation consequences of high- and low-frequency electromagnetic fields.
ePhysics v2 responds to the market demand to have an integrated, multi-disciplinary approach to electrical component design, essential for devices operating under high power, faster data rates and reduced physical size, where thermal and mechanical effects need to be evaluated due to their influence on the overall performance.
The ePhysics user interface, including design management front-end, 3D modeller, parametric control, simulation set-up and post-processing interfaces, have been migrated to the Ansoft desktop concept shared by HFSS and Maxwell 3D.
Engineers can easily account for the thermal and mechanical quantities that significantly contribute to a design's overall performance directly within the familiar, easy-to-use, Ansoft environment.
Coupling ePhysics with Maxwell 3D provides the cross-disciplinary analysis required in the design of electromechanical devices.
Typical applications include the analysis of electric machines, power-generation systems, transformers, micro-electromechanical systems (Mems) and solenoids.
"Now that ePhysics v2 can be coupled directly to Maxwell, we are able to assess the thermal and stress behaviour of magnetic components very conveniently," said Richard Osman, PE, principal product engineer, Siemens Energy and Automation.
"This advanced capability from Ansoft has greatly improved our ability to validate and optimize our designs before building hardware".
HFSS with ePhysics is vital for applications such as high-speed packages, antennas, monolithic microwave integrated circuits (MMICs), high-power microwave devices, military and broadcast communications and biological heating with radio frequency (RF) sources.
These analyses include high-power, temperature-induced stress and size changes of design components.
